电子工学ㆍ纳米信息工学专业


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电子工学ㆍ纳米信息工学专业
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电子工学ㆍ纳米信息工学专业

院系介绍

电子工程学技术在现代产业及日常生活中所占的比重越来越大,发挥着越来越重要的作用。 随着 Ubiquitous 社会的到来和产业技术尖端化的发展,人们渐渐意识到电子工程学在国家技术竞争中的重要作用。社会对能积极应对快速发展的尖端产业的创新型专业人才的需求越来越大, 为此, 本专业开设了深化理论教育课程, 通过产学联合及使用各种尖端实验设备的实务教育课程,培养兼备理论知识与实务能力,具有创新意识与资质的电子技术人才。

联络处

Major in Electronics EngineeringㆍNano and Information Engineering Kongju National University , Cheonan Campus 275 Budae-Dong, Seobuk-Gu, Cheonan-Si, Chungnam 330-717, Korea
  • 电话: +82-41-521-9144~5
  • 传真: +82-41-563-0330
  • E-mail: chl22@kongju.ac.kr
  • 网址: http://eletron.kongju.ac.kr/ , http://image.kongju.ac.kr (in Korean)
教科课程

Spring Semester

TOEIC (3 Credits)
Communicative Skill (3 Credits)
Entrepreneurship and Venture Management (3 Credits)
Calculus and Exercise (3 Credits)
Engineering Mathematics Ⅱ (3 Credits)
General Physics and Lab Ⅰ(3 Credits)
Introduction to Programming (3 Credits)
General Chemistry and Lab Ⅰ (3 Credits)
Circuit Theory Ⅰ (3 Credits)
Physical Electronics (3 Credits)
Introduction to Engineering Design (3 Credits)
Introduction to random variables (3 Credits)
Digital Engineering (3 Credits)
Electromagnetics (3 Credits)
C Programming (3 Credits)
Digital Control Systems (3 Credits)
Electronic Circuits Ⅱ (3 Credits)
Signals and Systems (3 Credits)
Communication theory (3 Credits)
Display Engineering (3 Credits)
Multimedia Communication Systems (3 Credits)
Embedded system (3 Credits)
Mobile Communication (3 Credits)

Fall Semester

Engineering Ethics (3 Credits)
Engineering Mathematics I (3 Credits)
General Physics and Lab Ⅱ (3 Credits)
General Chemistry and Lab Ⅱ (3 Credits)
Java Programming (3 Credits)
General Life Science (3 Credits)
Electronic Circuits Ⅰ (3 Credits)
Electromagnetic Fields (3 Credits)
Digital Signal Processing (3 Credits)
Design of Electronic Circuits Application (3 Credits)
ASIC Design (3 Credits)
Circuit Theory Ⅱ (3 Credits)
Windows Programming (3 Credits)
Microprocessor (3 Credits)
Semiconductor Engineering (3 Credits)
Digital Communication (3 Credits)
Computer Interface (3 Credits)
RF Circuit (3 Credits)
Field Training (3 Credits)
Image Signal Processing (3 Credits)
System Large Scale Integration Circuit (3 Credits)
Capstone Design (3 Credits)